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C — CHEMISTRY; METALLURGY; C08 — ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON; C08G — MACROMOLECULAR COMPOUNDS OBTA

Plasticizer free curing compositions comprising small particle size complexes of methylenedianiline and an alkali salt, e.g. a 3:1 coordination complex of MDA/alkali salt, with average diameter 60 micron or less, often 20 micron or less, e.g., 10 microns or less, dispersed in a volatile, non-polar, organic solvent are prepared.

The curing composition may be used in curing polyurethanes and epoxy resins. Type: Grant Filed: October 1, 2013 Date of Patent: June 21, 2016 Assignee: Chemtura Corporation Inventors: Thomas R. Doyle, Ronald O. Rosenberg Plasticizer free curing composition Patent number: 9321877

US9321877B2 US14/475,877 US201414475877A US9321877B2 US 9321877 B2 US9321877 B2 US 9321877B2 US 201414475877 A US201414475877 A US 201414475877A US 9321877 B2 US9321877 B2 US 9321

Plasticizer free curing compositions comprising small particle size complexes of methylenedianiline and an alkali salt, e.g. a 3:1 coordination complex of MDA/alkali salt, with average diameter 60 micron or less, often 20 micron or less, e.g., 10 microns or less, dispersed in a volatile, non-polar, organic solvent are prepared.